Normy DIN - Německé národní normy - strana 15999

Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ).

NEPLATNÁ vydána dne 1.3.2007

Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).

NEPLATNÁ vydána dne 1.3.2007

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA.

NEPLATNÁ vydána dne 1.7.2005

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA.

NEPLATNÁ vydána dne 1.8.2013

Mechanical standardization of semiconductor devices - Part 6-17: Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA).

NEPLATNÁ vydána dne 1.10.2007

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA).

NEPLATNÁ vydána dne 1.3.2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage.

NEPLATNÁ vydána dne 1.3.2008

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ).

NEPLATNÁ vydána dne 1.2.2009

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP).

NEPLATNÁ vydána dne 1.2.2009

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA).

NEPLATNÁ vydána dne 1.8.2011