Guidance document: Standard method for the specification for surface mounting components (SMDs) of assessed quality.

NEPLATNÁ vydána dne 1.10.1994

Registration and analysis of defects on printed board assemblies.

NEPLATNÁ vydána dne 1.6.1997

IEC 61761: Generic specification - Capability approval for surface mount technologies.

NEPLATNÁ vydána dne 1.12.1997

IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly.

NEPLATNÁ vydána dne 1.11.1998

Attachment materials for electronics assemblies - Part 1-2: Requirements for soldering paste fluxes for high quality; interconnections in electronics assembly.

NEPLATNÁ vydána dne 1.11.1998

IEC 61190-1-3: Requirements for electronic grade solder alloys and fluxed or non-fluxed solid solders for electronic soldering application.

NEPLATNÁ vydána dne 1.12.1998

IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies.

NEPLATNÁ vydána dne 1.3.1999

Printed board assemblies - Part 2: Sectional specification: Workmanship requirements and guidelines for soldered surface mount electronic assemblies.

NEPLATNÁ vydána dne 1.5.1999

IEC 61192-3: Printed board assemblies - Part 3: Sectional specification: Workmanship requirements for through-hole mount soldered assemblies.

NEPLATNÁ vydána dne 1.5.1999

Printed board assemblies - Part 4: Sectional specification: Workmanship requirements for terminal soldered assembly.

NEPLATNÁ vydána dne 1.5.1999