Potřebujeme váš souhlas k využití jednotlivých dat, aby se vám mimo jiné mohly ukazovat informace týkající se vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
(Dispositifs a semiconducteurs - Circuits integres - Partie 20: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches - Section 1: Exigences pour l´examen visuel interne)
Norma vydána dne 1.3.1994
Vybrané provedení:
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)
Norma vydána dne 30.6.1988
Vybrané provedení:
Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Amendement 1 - Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)
Změna vydána dne 22.9.1995
Vybrané provedení:
Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21-1:Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)
Norma vydána dne 10.4.1997
Vybrané provedení:
Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21:Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)
Norma vydána dne 10.4.1997
Vybrané provedení:
Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22-1: Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)
Norma vydána dne 10.4.1997
Vybrané provedení:
Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22: Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)
Norma vydána dne 10.4.1997
Vybrané provedení:Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification
Norma vydána dne 15.5.2002
Vybrané provedení:Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests
Norma vydána dne 23.5.2002
Vybrané provedení:Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers´ self-audit checklist and report
Norma vydána dne 17.5.2002
Vybrané provedení:Poslední aktualizace: 17.05.2026 (Počet položek: 2 278 942)
© Copyright 2026 NORMSERVIS s.r.o.