Normy DIN - Německé národní normy - strana 16796

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board.

NEPLATNÁ vydána dne 1.5.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300.

NEPLATNÁ vydána dne 1.5.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA.

NEPLATNÁ vydána dne 1.3.2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA.

NEPLATNÁ vydána dne 1.12.2020

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method.

NEPLATNÁ vydána dne 1.3.2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA.

NEPLATNÁ vydána dne 1.3.2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures.
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury..)

NEPLATNÁ vydána dne 1.10.1997

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (includes Amendment A1:2000).
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury..)

NEPLATNÁ vydána dne 1.3.2001

Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures.

NEPLATNÁ vydána dne 1.10.2002

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling.

NEPLATNÁ vydána dne 1.4.2014