Normy DIN - Německé národní normy - strana 16795

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction.

NEPLATNÁ vydána dne 1.5.2016

Component shape data specification for CAD library - Part 8-1: Generic Descriptions of the 2D and 3D description.

NEPLATNÁ vydána dne 1.7.2009

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology.
(Zkušební metody pro elektrotechnické materiály, desky s plošnými spoji a jiné propojovací struktury a sestavy - Část 1: Všeobecné zkušební metody a metodiky.)

NEPLATNÁ vydána dne 1.10.1997

Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys.

NEPLATNÁ vydána dne 1.11.2009

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of Resilience strength and Resilience strength Retention Factor of Flexible Dielectric Materials.

NEPLATNÁ vydána dne 1.12.2020

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning.

NEPLATNÁ vydána dne 1.11.2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500 MHz to 10 GHz).

NEPLATNÁ vydána dne 1.2.2015

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance.

NEPLATNÁ vydána dne 1.9.2022

Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator.

NEPLATNÁ vydána dne 1.11.2013

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials.

NEPLATNÁ vydána dne 1.4.2019