Potřebujeme váš souhlas k využití jednotlivých dat, aby se vám mimo jiné mohly ukazovat informace týkající se vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
Automaticky přeložený název:
Standardní praxe pro vizuální kontrolu Semiconductor Lead - lakovaný drát
NORMA vydána dne 1.5.2005
Označení normy: ASTM F584-87(2005)
Poznámka: NEPLATNÁ
Datum vydání normy: 1.5.2005
Kód zboží: NS-55784
Počet stran: 7
Přibližná hmotnost: 21 g (0.05 liber)
Země: Americká technická norma
Kategorie: Technické normy ASTM
Keywords:
bonding wire, inspection, lead-bonding wire, semiconductor packaging, visual inspection, wire, ICS Number Code 29.060.10 (Wires)
1. Scope | ||||||||
1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections. 1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope. 1.3 Photographs (Figs. X1-X1.5 ) are included in Appendix X1 as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality. 1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use. |
||||||||
2. Referenced Documents | ||||||||
|
Poslední aktualizace: 01.11.2024 (Počet položek: 2 208 817)
© Copyright 2024 NORMSERVIS s.r.o.