Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire
NORMA vydána dne 1.5.2005
Designation standards: ASTM F584-87(2005)
Note: NEPLATNÁ
Publication date standards: 1.5.2005
The number of pages: 7
Approximate weight : 21 g (0.05 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM
Keywords:
bonding wire, inspection, lead-bonding wire, semiconductor packaging, visual inspection, wire, ICS Number Code 29.060.10 (Wires)