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Doplňující informace

ASTM D5109-12

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

Automaticky přeložený název:

Standardní zkušební metody pro měděné na termosety desky pro deskách s plošnými spoji

NORMA vydána dne 1.11.2012

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Provedení	PDF - okamžité stažení - 1 923.90 Kč Tištěné - 1 923.90 Kč
Dostupnost	SKLADEM
Cena	1 923.90 Kč bez DPH
1 923.90 Kč

Informace o normě:

Označení normy: ASTM D5109-12
Poznámka: NEPLATNÁ
Datum vydání normy: 1.11.2012
Kód zboží: NS-29869
Počet stran: 9
Přibližná hmotnost: 27 g (0.06 liber)
Země: Americká technická norma
Kategorie: Technické normy ASTM

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Kategorie - podobné normy:

Laminované desky
Tištěné obvody a desky s plošnými spoji

Anotace textu normy ASTM D5109-12 :

Keywords:

copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)

Doplňující informace

1. Scope

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 The procedures appear in the following sections:

Procedure

Section

Referenced Documents

Conditioning

Dielectric Breakdown Voltage Parallel to Laminations

Dimensional Instability

Dissipation Factor

Flammability Rating Test

Flexural Strength, Flatwise at Elevated Temperature

Flexural Strength, Flatwise at Room Temperature

Oven Blister Test

Peel Strength Test at Elevated Temperature

Peel Strength Test at Room Temperature

Permittivity

Pin Holes in Copper Surface

Purity of Copper

Scratches in Copper Surface

Solder Float Test

Solvent Resistance

Surface Resistivity

Volume Resistivity

Terminology

Thickness & Thickness Variation

Warp or Twist

Water Absorption

1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

2. Referenced Documents

D257-14(2021)e1	Standard Test Methods for DC Resistance or Conductance of Insulating Materials (Includes all amendments and changes 5/6/2021).
D374-99	Standard Test Methods for Thickness of Solid Electrical Insulation
D618-21	Standard Practice for Conditioning Plastics for Testing
D1825-03	Standard Practice for Etching and Cleaning Copper-Clad Electrical Insulating Materials and Thermosetting Laminates for Electrical Testing (Withdrawn 2012)
D150-22	Standard Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation
E53-07	Standard Test Method for Determination of Copper in Unalloyed Copper by Gravimetry
D3636-19	Standard Practice for Sampling and Judging Quality of Solid Electrical Insulating Materials
NEMA Publication Number LI 1-1975	Test for Hot Peel Strength of Copper-Clad Industrial Laminates for Printed Circuits Available from National Electronic Manufacturers Association (NEMA), 2101 L St., NW, Washington, DC 20037.
D1711-24	Standard Terminology Relating to Electrical Insulation
D1867-13	Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020)
D229-19e1	Standard Test Methods for Rigid Sheet and Plate Materials Used for Electrical Insulation (Includes all amendments and changes 3/23/2023).
D1531-06	Standard Test Methods for Relative Permittivity (Dielectric Constant) and Dissipation Factor by Fluid Displacement Procedures (Withdrawn 2012)