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ASTM D5109-12

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

NORMA vydána dne 1.11.2012

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The information about the standard:

Designation standards: ASTM D5109-12
Note: NEPLATNÁ
Publication date standards: 1.11.2012
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: American technical standard
Kategorie: Technické normy ASTM

Annotation of standard text ASTM D5109-12 :

Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)