Normy DIN - Německé národní normy - strana 17026

Semiconductor devices - Micro-electromechanical devices - Part 10: Micropillar compression test for MEMS materials.

NEPLATNÁ vydána dne 1.5.2010

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials.

NEPLATNÁ vydána dne 1.6.2010

Semiconductor devices - Micro-electromechanical devices - Part 12: A method for fatigue testing thin film materials using the resonant vibration of a MEMS structure.

NEPLATNÁ vydána dne 1.5.2010

Semiconductor devices - Micro electro mechanical devices - Part 13: Bend- and shear- test methods of measuring adhesive strength for MEMS structures.

NEPLATNÁ vydána dne 1.5.2010

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials.

NEPLATNÁ vydána dne 1.10.2010

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass.

NEPLATNÁ vydána dne 1.11.2012

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass.
(Polovodičové součástky - Mikroelektromechanické součástky - Část 15: Metoda zkoušení pevnosti spojení mezi PDMS a sklem..)

NEPLATNÁ vydána dne 1.1.2016

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods.

NEPLATNÁ vydána dne 1.11.2012

Semiconductor devices - Micro- electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin film.

NEPLATNÁ vydána dne 1.6.2011

Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials.

NEPLATNÁ vydána dne 1.6.2011