Normy DIN - Německé národní normy - strana 16878

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards).
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 3: Zkušební metody pro propojovací struktury (desky s plošnými spoji)..)

NEPLATNÁ vydána dne 1.10.1997

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards).
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 3: Zkušební metody pro propojovací struktury (desky s plošnými spoji)..)

NEPLATNÁ vydána dne 1.8.2000

Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures.

NEPLATNÁ vydána dne 1.11.2002

Test methods for electrical materials, Interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks.

NEPLATNÁ vydána dne 1.10.2014

Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering Flux.

NEPLATNÁ vydána dne 1.4.2013

Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste.

NEPLATNÁ vydána dne 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles.

NEPLATNÁ vydána dne 1.12.2020

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire.

NEPLATNÁ vydána dne 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes.

NEPLATNÁ vydána dne 1.11.2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies.

NEPLATNÁ vydána dne 1.11.2019