Normy IEC - Mezinárodní elektrotechnická organizace - strana 605

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 2-9: Materiaux de base renforces, plaques et non plaques - Feuilles stratifiees renforcees en tissu de verre de type E epoxyde, modifie ou non, et bismaleimide/triazine, d´inflammabilite definie (essai de combustion verticale), plaquees cuivre)

Norma vydána dne 27.2.2003

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-3: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Film flexible de polyester a revetement adhesif)

Norma vydána dne 10.2.1999

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-4: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Film flexible polyimide a revetement adhesif)

Norma vydána dne 10.2.1999

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 3-5: Collection de specifications intermediaires pour les materiaux de base non renforces, recouverts ou non (prevus pour les circuits imprimes flexibles) - Films a transfert de colle)

Norma vydána dne 10.2.1999

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-1: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E d´inflammabilite definie)

Norma vydána dne 30.1.2008

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-11: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques - Tissu de verre epoxyde preimpregne de type E non halogene d´inflammabilite definie)

Norma vydána dne 22.9.2005

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-12: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques - Tissu de verre epoxyde preimpregne multifonctionnel de type E non halogene, d´inflammabilite definie)

Norma vydána dne 5.9.2005

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour circuits imprimes et autres structures d´interconnexion - Partie 4-14: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Norma vydána dne 26.5.2009

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour cartes imprimees et autres structures d´interconnexion - Partie 4-15: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne multifonctionnel de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Norma vydána dne 26.5.2009

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
(Materiaux pour cartes imprimees et autres structures d´interconexion - Partie 4-16: Serie de specifications intermediaires pour materiaux preimpregnes, non plaques (pour la fabrication des cartes multicouches) - Tissu de verre epoxyde preimpregne multifonctionnel non halogene de type E d´inflammabilite definie (essai de combustion verticale) destine aux assemblages sans plomb)

Norma vydána dne 26.5.2009