Semiconductor integrated circuits—Specification of leadframes for small outline package

Norma vydána dne 15.5.2015

Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Norma vydána dne 30.8.2019

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Norma vydána dne 17.9.2018

Mechanical standardization of semiconductor devices—Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of quad flat packs (QFP)
K dispozici od: únor 2027

Norma vydána dne 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Norma vydána dne 23.5.2023

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

Norma vydána dne 31.12.2025

Mechanical standardization of semiconductor devices—Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guide for ball grid array (BGA)
K dispozici od: únor 2027

Norma vydána dne 30.7.2026

Mechanical standardization of semiconductor devices—Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of small outline J-lead packages SOJ
K dispozici od: únor 2027

Norma vydána dne 30.7.2026

Medical glass thermometer

Norma vydána dne 29.4.2024

Potentiometers for use in electronic equipment--Part 3:Sectional specification--Rotary precision potentiometers

Norma vydána dne 22.12.1995