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ASTM F533-02a
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers (Withdrawn 2003) (Includes all amendments And changes 8/16/2017).
Automaticky přeložený název:
Standardní zkušební metoda pro tloušťky a tloušťka variace křemíkových desek (Withdrawn 2003 )
NORMA vydána dne 10.12.2002
Informace o normě:
Označení normy: ASTM F533-02a
Poznámka: NEPLATNÁ
Datum vydání normy: 10.12.2002
Kód zboží: NS-55630
Počet stran: 5
Přibližná hmotnost: 15 g (0.03 liber)
Země: Americká technická norma
Kategorie: Technické normy ASTM
Anotace textu normy ASTM F533-02a :
Keywords:
semiconductor, silicon, thickness, thickness variation, total thickness variation, wafer, ICS Number Code 29.045 (Semiconducting materials)
Doplňující informace
| 1. Scope |
|
This standard was transferred to SEMI (www.semi.org) May 2003 1.1 This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. 1.2 This test method is intended primarily for use with wafers that meet the dimension and tolerance requirements of SEMI Specifications M1. However, it can be applied to circular silicon wafers, or substrates of any diameter and thickness that can be handled without breaking. 1.3 This test method is suitable for both contact and contactless gaging equipment. Precision statements have been established for each. 1.4 The values stated in inch-pound units are to be regarded as standard. The values in parentheses are for information only. 1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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