Normy DIN - Německé národní normy - strana 17526

Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity.

NEPLATNÁ vydána dne 1.11.2020

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity.

NEPLATNÁ vydána dne 1.7.2023

Reciprocating internal combustion engines - Connecting dimensions for flywheels and flexible couplings.

NEPLATNÁ vydána dne 1.11.1995

Reciprocating internal combustion engines - Dimensions and requirements for flywheels and flexible couplings.

NEPLATNÁ vydána dne 1.7.2000

Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method.

NEPLATNÁ vydána dne 1.8.2014

VDE 0810-881. Cause & Effect Table.

NEPLATNÁ vydána dne 1.4.2016

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement.

NEPLATNÁ vydána dne 1.9.2015

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 2: Phase jitter measurement method.

NEPLATNÁ vydána dne 1.4.2017

Measurement techniques of piezoelectric, dieletiric and electrostatic oscillators - Part 3: Frequency aging test methods.

NEPLATNÁ vydána dne 1.8.2016

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 4: Short-term frequency stability test methods.

NEPLATNÁ vydána dne 1.8.2016