Normy DIN - Německé národní normy - strana 17426

Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test.

NEPLATNÁ vydána dne 1.10.2005

Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test.

NEPLATNÁ vydána dne 1.10.2005

Surface-mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test.

NEPLATNÁ vydána dne 1.12.2006

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-4: Cyclic bending test.

NEPLATNÁ vydána dne 1.10.2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test.

NEPLATNÁ vydána dne 1.10.2007

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints.

NEPLATNÁ vydána dne 1.10.2009

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices.

NEPLATNÁ vydána dne 1.1.2013

IEC 62127, Ed.1: Test 5N01: Temperature cycling test for soldering loint (includes also 5D01, 5D02, 5D03, 5M01, 5P01, 5P02).

NEPLATNÁ vydána dne 1.8.2001

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN.
(Zkoušení vlivů prostředí a trvanlivosti - Zkušební metody pro desky s plošnými spoji s povrchovou montáží pouzder FBGA, BGA, FLGA, LDA, SON a QFN s vývody typu plošné pole..)

NEPLATNÁ vydána dne 1.4.2005

VDE 0491-3-3. Nuclear power plants - Instrumentation and control systems important to safety - Software for computer-based I&C systems supporting category B and C functions.

NEPLATNÁ vydána dne 1.11.2002