Normy DIN - Německé národní normy - strana 17014

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: Test methods for printed board assemblies - Soldering paste using fine solder particles.

NEPLATNÁ vydána dne 1.12.2020

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire.

NEPLATNÁ vydána dne 1.7.2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes.

NEPLATNÁ vydána dne 1.11.2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies.

NEPLATNÁ vydána dne 1.11.2019

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards.

NEPLATNÁ vydána dne 1.2.2016

Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT).

NEPLATNÁ vydána dne 1.2.2018

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards.

NEPLATNÁ vydána dne 1.11.2018

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies.

NEPLATNÁ vydána dne 1.11.2002

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies.

NEPLATNÁ vydána dne 1.11.2002

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly.
(Připojovací materiály pro elektronickou montáž - Část 1-2: Požadavky na pájecí pasty pro vysoce kvalitní propojování v elektronické montáži..)

NEPLATNÁ vydána dne 1.1.2003