Normy DIN - Německé národní normy - strana 16930

Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator.

NEPLATNÁ vydána dne 1.11.2013

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials.

NEPLATNÁ vydána dne 1.4.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board.

NEPLATNÁ vydána dne 1.5.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300.

NEPLATNÁ vydána dne 1.5.2019

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA.

NEPLATNÁ vydána dne 1.3.2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA.

NEPLATNÁ vydána dne 1.12.2020

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method.

NEPLATNÁ vydána dne 1.3.2022

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA.

NEPLATNÁ vydána dne 1.3.2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures.
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury..)

NEPLATNÁ vydána dne 1.10.1997

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (includes Amendment A1:2000).
(Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury..)

NEPLATNÁ vydána dne 1.3.2001