Normy DIN - Německé národní normy - strana 16894

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad.

NEPLATNÁ vydána dne 1.6.2022

Materials for printed boards and other interconnection structures - Part 2-6: Sectional specification set for reinforced base materials, clad and unclad; Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad.

NEPLATNÁ vydána dne 1.1.2002

Materials for interconnection structures - Part 2-7: Sectional specification set for reinforced base materials, clad and unclad; epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad.

NEPLATNÁ vydána dne 1.1.2000

Materials for printed boards and other interconnection structures - Part 2-8: Sectional specification set for reinforced base materials, clad and unclad; Modified epoxide woven fiberglass laminate sheets of defined flammability (vertical burning test).

NEPLATNÁ vydána dne 1.1.2002

Materials for printed boards and other interconnection structures - Part 2-9: Sectional specification set for reinforced base materials, clad and unclad; Bismaleimide/triazine, modified epoxide or unmodified woven E-glass reinforced laminate sheets of defined flammability (vertical burning test) copper-clad.

NEPLATNÁ vydána dne 1.1.2002

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types).

NEPLATNÁ vydána dne 1.5.2008

Materials for printed boards and other interconnecting structures - Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Section 1: Epoxide woven E-glass prepreg of defined flammability (vertical burning test).

NEPLATNÁ vydána dne 1.10.2001

Materials for interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability.

NEPLATNÁ vydána dne 1.3.2006

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test).

NEPLATNÁ vydána dne 1.4.2003

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test).

NEPLATNÁ vydána dne 1.4.2003