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DIN - je chráněné označení německých národních technických norem.
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.4.2003
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.4.2003
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly.
NEPLATNÁ vydána dne 1.12.2010
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly.
NEPLATNÁ vydána dne 1.12.2010
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.4.2003
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.4.2003
Vybrané provedení:Poslední aktualizace: 18.01.2026 (Počet položek: 2 257 146)
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