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DIN - je chráněné označení německých národních technických norem.
Materials for interconnection structures - Part 2-26: Sectional specification set for reinforced base materials, clad and unclad; Section 26: Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad.
NEPLATNÁ vydána dne 1.2.2003
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad.
NEPLATNÁ vydána dne 1.11.2009
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad.
NEPLATNÁ vydána dne 1.11.2009
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 4.1 at 1 GHz) and flammability (vertical burning test), copper-clad.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less than 3.7 at 1 GHz) and flammability (vertical burning test), copper-clad.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly.
NEPLATNÁ vydána dne 1.7.2007
Vybrané provedení:Poslední aktualizace: 18.01.2026 (Počet položek: 2 257 146)
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