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DIN - je chráněné označení německých národních technických norem.
Base materials for printed circuits - Part 2: Specifications; specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board.
NEPLATNÁ vydána dne 1.6.1996
Vybrané provedení:Amendment to IEC 60249-2-17: Base materials for printed circuits - Part 2: Specifications; specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board; Amendment A3.
NEPLATNÁ vydána dne 1.1.1999
Vybrané provedení:Base materials for printed circuits; part 2: specifications; specification No. 18: bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.12.1993
Vybrané provedení:Base materials for printed circuits - Part 2: Specifications; Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.9.2001
Vybrané provedení:Base materials for printed circuits - Part 2: Specifications; specification No. 18: Bismaleimide/triazine modified epoxid woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.8.1994
Vybrané provedení:Base materials for printed circuits - Part 2: Specifications; specification No. 18: Bismaleimide/triazine modified epoxid woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
NEPLATNÁ vydána dne 1.6.1996
Vybrané provedení:Base materials for printed circuits; part 2: specifications; specification No. 19: thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
NEPLATNÁ vydána dne 1.12.1993
Vybrané provedení:Base materials for printed circuits - Part 2: Specifications; Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
NEPLATNÁ vydána dne 1.8.1994
Vybrané provedení:Base materials for printed circuits - Part 2: Specifications; Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
NEPLATNÁ vydána dne 1.6.1996
Vybrané provedení:Base materials for printed circuits; specifications; specification No. 2: phenolic cellulose paper copper-clad laminated sheet, economic quality; identical with IEC 60249-2-2:1985.
NEPLATNÁ vydána dne 1.12.1989
Vybrané provedení:Poslední aktualizace: 15.09.2026 (Počet položek: 2 301 408)
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