Registration and analysis of defects on printed board assemblies.

NEPLATNÁ vydána dne 1.6.1997

IEC 61761: Generic specification - Capability approval for surface mount technologies.

NEPLATNÁ vydána dne 1.12.1997

IEC 61190-1-1: Attachment materials for elektronic assemblies - Part 1-1: Requirements for soldering fluxes for high quality interconnections in electronic assembly.

NEPLATNÁ vydána dne 1.11.1998

Attachment materials for electronics assemblies - Part 1-2: Requirements for soldering paste fluxes for high quality; interconnections in electronics assembly.

NEPLATNÁ vydána dne 1.11.1998

IEC 61190-1-3: Requirements for electronic grade solder alloys and fluxed or non-fluxed solid solders for electronic soldering application.

NEPLATNÁ vydána dne 1.12.1998

IEC 61192-1: Printed board assemblies - Part 1: Generic specification: Workmanship requirements and guidelines for soldered electronic assemblies.

NEPLATNÁ vydána dne 1.3.1999

Printed board assemblies - Part 2: Sectional specification: Workmanship requirements and guidelines for soldered surface mount electronic assemblies.

NEPLATNÁ vydána dne 1.5.1999

IEC 61192-3: Printed board assemblies - Part 3: Sectional specification: Workmanship requirements for through-hole mount soldered assemblies.

NEPLATNÁ vydána dne 1.5.1999

Printed board assemblies - Part 4: Sectional specification: Workmanship requirements for terminal soldered assembly.

NEPLATNÁ vydána dne 1.5.1999

Package labels for electronic components using bar code and two dimensional symbologies.

NEPLATNÁ vydána dne 1.4.2000