Mechanical standardization of semiconductor devices. Recommendations for a coding system and classification into forms of package outlines for semiconductor devices.

NEPLATNÁ vydána dne 1.4.1992

Mechanical standardization of semiconductor devices. Recommendations for tape automated bonding (TAB) of integrated circuits.

NEPLATNÁ vydána dne 1.4.1992

Mechanical standardization of semiconductor devices. Specification for the preparation of outline drawings of surface mounted semiconductor device packages.

NEPLATNÁ vydána dne 1.4.1992

Specification for dimensions of semiconductor devices and integrated electronic circuits.

NEPLATNÁ vydána dne 30.11.1965

Mechanical standardization of semiconductor devices.

NEPLATNÁ vydána dne 15.12.1967

Mechanical standardization of semiconductor devices.

NEPLATNÁ vydána dne 15.10.1971

Mechanical standardization of semiconductor devices.

NEPLATNÁ vydána dne 15.6.1975

Mechanical standardization of semiconductor devices.

NEPLATNÁ vydána dne 15.11.1980

Mechanical standardization of semiconductor devices.

NEPLATNÁ vydána dne 15.8.1983

Mechanical standardization of semiconductor devices.

NEPLATNÁ vydána dne 15.3.1989