Cookies
Potřebujeme váš souhlas k využití jednotlivých dat, aby se vám mimo jiné mohly ukazovat informace týkající se vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
ISO/TS 10303-1686:2018-ed.5.0
Industrial automation systems and integration — Product data representation and exchange — Part 1686: Application module: Interconnect module usage view
Přeložit název
NORMA vydána dne 18.12.2018
| Dostupnost | SKLADEM |
| Cena | NA DOTAZ bez DPH |
| NA DOTAZ |
Informace o normě:
Označení normy: ISO/TS 10303-1686:2018-ed.5.0
Datum vydání normy: 18.12.2018
Kód zboží: NS-943533
Přibližná hmotnost: 300 g (0.66 liber)
Země: Mezinárodní technická norma
Kategorie: Technické normy ISO
Kategorie - podobné normy:
Anotace textu normy ISO/TS 10303-1686:2018-ed.5.0 :
Description / Abstract: ISO/TS 10303-1686:2018-11 specifies the application module for Interconnect module usage view. The following are within the scope of ISO/TS 10303-1686:2018-11: the representation of the information needed to describe the interface definition of the interconnect substrate. This view may be used for the purpose of electrical and mechanical simulation and verification of the interconnect substrate performance when applied in the next level of assembly. Complex features including cavities and cutouts are predefined as well as industry standard edge treatments. The usage view may be treated as a requirement definition by a design organization with links established to relevant design details in an unpublished model maintained by that design organization. The usage view is a predefined model of a subset of documentation classified as interface control documententation. interconnect substrate features used for next level design;interconnect substrate cavities;interconnect substrate cutouts;interconnect substrate orientation information;interconnect substrate terminals;interconnect substrate thickness requirement;interconnect substrate features that may be accessible from the exterior of the end item;interconnect substrate terminals that are internally connected;interconnect substrate terminal identification;geometric dimensioning and tolerancing.
Doporučujeme:
