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ASTM F72-21
Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2024)
Přeložit název
NORMA vydána dne 1.1.2021
Informace o normě:
Označení normy: ASTM F72-21
Poznámka: NEPLATNÁ
Datum vydání normy: 1.1.2021
Kód zboží: NS-1029263
Počet stran: 11
Přibližná hmotnost: 33 g (0.07 liber)
Země: Americká technická norma
Kategorie: Technické normy ASTM
Kategorie - podobné normy:
Anotace textu normy ASTM F72-21 :
Keywords:
ICS Number Code 31.080.01 (Semiconductor devices in general)
Doplňující informace
| 1. Scope | ||||||||
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1.1?This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire. Note 1:?Trace metallic elements have a significant effect upon
the mechanical properties and thermal stability of high-purity gold
wire. It is customary in manufacturing to add controlled amounts of
selected impurities to gold to modify or stabilize bonding wire
properties, or both. This practice is known variously as modifying,
stabilizing, or doping. The first two wire classifications denoted
in this specification refer to wire made with either of two
particular modifiers, copper or beryllium, in general use. In the
third and fourth wire classifications, high-strength and special
purpose wire, the identity of modifying additives is not
restricted.
1.2?The values stated in SI units are to be regarded as standard. The values given in parentheses after SI units are provided for information only and are not considered standard. 1.3?The following hazard caveat pertains only to the test method portion, Section 9, of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use. 1.4?This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee. |
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| 2. Referenced Documents | ||||||||
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