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ASTM F357-78(2002)
Standard Practice for Determining Solderability of Thick Film Conductors (Withdrawn 2008)
Automaticky přeložený název:
Standardní praxe pro stanovení pájitelnosti a Tenkovrstvé dirigentů (Withdrawn 2008 )
NORMA vydána dne 10.12.2002
Informace o normě:
Označení normy: ASTM F357-78(2002)
Poznámka: NEPLATNÁ
Datum vydání normy: 10.12.2002
Kód zboží: NS-55038
Počet stran: 2
Přibližná hmotnost: 6 g (0.01 liber)
Země: Americká technická norma
Kategorie: Technické normy ASTM
Anotace textu normy ASTM F357-78(2002) :
Keywords:
hybrid microcircuits, solderability, solder wetting, thick-film metallization, ICS Number Code 29.050 (Superconductivity and conducting materials)
Doplňující informace
| Significance and Use |
|
The procedure of this practice is suitable for process control. No interlaboratory precision has been established for the procedure of this practice. Therefore, this practice should not be used for the acceptance or rejection of material exchanged between buyers and sellers. |
| 1. Scope |
|
1.1 This practice covers a procedure for determining the solderability of thick-film conductors. The procedure has been adapted from several techniques that are in routine use for testing this property. 1.2 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only. 1.3 This standard does not purport to address the safety concerns, if any, associated with its use. It is the responsibility of whoever uses this standard to consult and establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. |
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