Industrial automation systems and integration — Product data representation and exchange — Part 1689: Application module: Interconnect physical requirement allocation
NORMA vydána dne 18.12.2018
Označení normy: ISO/TS 10303-1689:2018-ed.5.0
Datum vydání normy: 18.12.2018
Přibližná hmotnost: 300 g (0.66 liber)
Země: Mezinárodní technická norma
Kategorie: Technické normy ISO
Description / Abstract: ISO/TS 10303-1689:2018-11 specifies the application module for Interconnect physical requirement allocation. The following are within the scope of ISO/TS 10303-1689:2018-11: thermal isolation requirement definition;electrical isolation requirement definition;thermal isolation template for substrate design;electrical isolation template for substrate design;length tolerance on spacing requirement;allocation of an isolation requirement to a shield realized as part of an interconnect substrate.