Industrial automation systems and integration — Product data representation and exchange — Part 1688: Application module: Interconnect non planar shape
NORMA vydána dne 18.5.2010
Označení normy: ISO/TS 10303-1688:2010-ed.2.0
Datum vydání normy: 18.5.2010
Přibližná hmotnost: 300 g (0.66 liber)
Země: Mezinárodní technická norma
Kategorie: Technické normy ISO
Description / Abstract: ISO/TS 10303-1688:2010-03 specifies the application module for Interconnect non planar shape. The following are within the scope of ISO/TS 10303-1688:2010-03: three dimensional manifold surface representation of an interconnect substrate;placement of footprint and other planar feature definitions in a three dimensional manifold surface representation including changing the planar shape to a manifold shape.