Industrial automation systems and integration — Product data representation and exchange — Part 1650: Application module: Bare die
NORMA vydána dne 18.12.2018
Označení normy: ISO/TS 10303-1650:2018-ed.5.0
Datum vydání normy: 18.12.2018
Přibližná hmotnost: 300 g (0.66 liber)
Země: Mezinárodní technická norma
Kategorie: Technické normy ISO
Description / Abstract: ISO/TS 10303-1650:2018-11 specifies the application module for Bare die. The following is within the scope of ISO/TS 10303-1650:2018-11: The representation of the information needed to describe a semiconductor material product that is an integrated circuit component, or that may be a discrete active component, or that may be included as a component in an electronic assembly. Terminal information is supported, including explicit shape data. A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called a package. definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural simulation model, and shape.