Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Espanola de Normalización in April of 2018.)
NORMA vydána dne 1.4.2018
Designation standards: UNE-EN IEC 61190-1-3:2018
Publication date standards: 1.4.2018
The number of pages: 52
Approximate weight : 156 g (0.34 lbs)
Country: Spanish technical standard
Kategorie: Technické normy UNE