Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (Endorsed by Asociación Espanola de Normalización in February of 2026.)
NORMA vydána dne 1.2.2026
Designation standards: UNE-EN IEC 60749-22-1:2026
Publication date standards: 1.2.2026
The number of pages: 70
Approximate weight : 210 g (0.46 lbs)
Country: Spanish technical standard
Kategorie: Technické normy UNE