Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
NORMA vydána dne 1.6.2012
Designation standards: UNE-EN 62047-9:2011
Publication date standards: 1.6.2012
The number of pages: 29
Approximate weight : 87 g (0.19 lbs)
Country: Spanish technical standard
Kategorie: Technické normy UNE