Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
NORMA vydána dne 18.1.2021
Designation standards: UNE-EN 61190-1-3:2007
Note: NEPLATNÁ
Publication date standards: 18.1.2021
The number of pages: 39
Approximate weight : 117 g (0.26 lbs)
Country: Spanish technical standard
Kategorie: Technické normy UNE