Attachment materials for electronic assembly -- Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)
NORMA vydána dne 1.5.2010
Designation standards: UNE-EN 61190-1-2:2002
Note: NEPLATNÁ
Publication date standards: 1.5.2010
The number of pages: 27
Approximate weight : 81 g (0.18 lbs)
Country: Spanish technical standard
Kategorie: Technické normy UNE