
Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
NORMA vydána dne 1.7.2019
Označení normy: SAE ARP6415
Datum vydání normy: 1.7.2019
Země: Americká technická norma
Kategorie: Technické normy SAE
This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.
SUBFILE: Aerospace
TYPE OF DOCUMENT: Aerospace Standard