JIS C62137-4:2016

Electronics assembly technology -- Part 4: Endurance test methods for solder joint of area array type package surface mount devices

NORMA vydána dne 22.3.2016

Japonsky -
Elektronické PDF (NA DOTAZ)

Japonsky -

Tištěné (NA DOTAZ)

The information about the standard:

Designation standards: JIS C62137-4:2016
Publication date standards: 22.3.2016
The number of pages: 42
Approximate weight : 126 g (0.28 lbs)
Country: Other standards
Kategorie: Technické normy JIS