JIS C61760-3:2022

Surface mounting technology -- Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

NORMA vydána dne 22.8.2022

Japonsky -
Elektronické PDF (NA DOTAZ)

Japonsky -

Tištěné (NA DOTAZ)

The information about the standard:

Designation standards: JIS C61760-3:2022
Publication date standards: 22.8.2022
The number of pages: 44
Approximate weight : 132 g (0.29 lbs)
Country: Other standards
Kategorie: Technické normy JIS