JIS C5630-13:2014

Semiconductor devices -- Micro-electromechanical devices -- Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

NORMA vydána dne 20.2.2014

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Elektronické PDF (NA DOTAZ)

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Tištěné (NA DOTAZ)

The information about the standard:

Designation standards: JIS C5630-13:2014
Publication date standards: 20.2.2014
The number of pages: 12
Approximate weight : 36 g (0.08 lbs)
Country: Other standards
Kategorie: Technické normy JIS