IEEE/IEC International Standard--Format for LSI-Package-Board Interoperable design
NORMA vydána dne 19.10.2023
Označení normy: IEEE/IEC 63055-2023
Datum vydání normy: 19.10.2023
Počet stran: 298
Přibližná hmotnost: 925 g (2.04 liber)
Země: Mezinárodní technická norma
Kategorie: Technické normy IEEE
Adoption Standard - Active.
A method is provided for specifying a common interoperable format for electronic systems design. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in the large-scale integration-package-board designs. The method provides the ability to make electronic systems a key consideration early in the design process; design tools can use it to seamlessly exchange information/data.
ISBN: 979-8-8557-0216-3, 979-8-8557-0217-0
Number of Pages: 298
Product Code: STD26543, STDPD26543
Keywords: common interoperable format, components, design analysis, design rules, geometries, IEEE 2401™, large-scale integration (LSI), netlists, packages for LSI circuits, printed circuit board, project management, Verilog-HDL
Category: Design Automation