IEC 61760-4-ed.1.1

Annotation of standard text IEC 61760-4-ed.1.1 :

IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering. This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication. LIEC 61760-4:2015+A1:2018 specifie la classification des dispositifs sensibles a lhumidite en niveaux de sensibilite lies a la chaleur de brasage, ainsi que les dispositions relatives a lemballage, letiquetage et la manipulation. La presente partie de lIEC 61760 etend les methodes de classification et demballage a ces composants lorsque les normes existantes ne sont pas exigees ou sont inappropriees. Dans ce cas, la presente norme introduit des niveaux de sensibilite a lhumidite supplementaires ainsi quune methode demballage alternative. La presente norme sapplique aux appareils destines au brasage par refusion, tels que les composants pour montage en surface, y compris les appareils a insertion specifiques (dont les fournisseurs ont specifiquement documente le support pour le brasage par refusion), mais ne sapplique pas aux appareils a semi-conducteurs et aux appareils destines au brasage a la vague. Cette version consolidee comprend la premiere edition (2015) et son amendement 1 (2018). Il nest donc pas necessaire de commander lamendement avec cette publication.