Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
NORMA vydána dne 28.8.2006
Designation standards: IEC 62258-6-ed.1.0
Publication date standards: 28.8.2006
The number of pages: 9
Approximate weight : 27 g (0.06 lbs)
Country: International technical standard
Kategorie: Technické normy IEC
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2