Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
NORMA vydána dne 28.8.2006
Označení normy: IEC 62258-6-ed.1.0
Datum vydání normy: 28.8.2006
Počet stran: 9
Přibližná hmotnost: 27 g (0.06 liber)
Země: Mezinárodní technická norma
Kategorie: Technické normy IEC
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2