IEC 62137-1-3-ed.1.0

Anotace textu normy IEC 62137-1-3-ed.1.0 :

The test method described in IEC 62137-1-3:2008 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints. La methode dessai decrite dans la CEI 62137-1-3:2008 sapplique aux joints de soudure situes entre les extremites des composants pour montage en surface (CMS) et les plages daccueil des cartes a circuits imprimees (PWBs). Le present essai a pour but devaluer la resistance des joints de soudure des composants a sorties multiples de plus grande taille et dautres composants dans des appareils (par exemple des appareils mobiles portatifs) au cas ou lappareil chuterait. Les proprietes des joints de soudure (par exemple, alliage de soudure, substrat, dispositif assemble ou conception, etc.) sont evaluees pour aider a ameliorer la resistance des joints de soudure.