IEC 61709-ed.3.0

Anotace textu normy IEC 61709-ed.3.0 :

IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004. This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319. The contents of the corrigendum of October 2019 have been included in this copy. Keywords: failure rate data, reliability prediction of electric components IEC 61709:2017 donne des recommandations concernant lutilisation des donnees de taux de defaillance pour les previsions de fiabilite de composants electriques utilises dans les equipements. La methode exposee dans le present document utilise le concept des conditions de reference, qui sont les valeurs typiques des contraintes observees sur les composants dans la plupart des applications. Les conditions de reference sont utiles dans la mesure ou elles fournissent une base normalisee connue a partir de laquelle les taux de defaillance peuvent etre modifies afin de prendre en compte les differences observees dans lenvironnement en fonction des environnements pris comme conditions de reference. Chaque utilisateur peut appliquer les conditions de reference definies dans le present document ou bien appliquer ses propres conditions de reference. Lorsque les taux de defaillance indiques dans les conditions de reference sont utilises, cela permet de realiser des previsions de fiabilite realistes des la premiere phase de conception. Les modeles de contraintes decrits dans le present document sont generiques et peuvent etre utilises comme base de conversion des donnees de taux de defaillance dans ces conditions de reference, dans des conditions de fonctionnement reelles si necessaire, ce qui simplifie lapproche previsionnelle. La conversion des donnees de taux de defaillance nest possible que dans les limites de fonctionnement specifiees pour les composants. Le present document donne egalement des recommandations concernant les methodes pour constituer une base de donnees de taux de defaillance des composants afin que les taux fournis puissent etre employes avec les modeles de contraintes fournis. Les conditions de reference pour les donnees de taux de defaillance sont definies, de facon a permettre de comparer, dans des conditions uniformes, des donnees dorigines differentes. Si les donnees de taux de defaillance sont fournies conformement au present document, il est possible de se dispenser dinformation supplementaire sur les conditions definies Le present document ne fournit pas des taux de defaillance de base pour les composants; elle fournit en revanche des modeles qui permettent de convertir les taux de defaillance obtenus par dautres moyens d’une condition de fonctionnement a l’autre. La methodologie de prevision decrite dans le present document pose comme hypothese lutilisation des elements au cours de leur duree de vie. Les methodes decrites dans le present document ont une application generale, mais s’appliquent specifiquement a une selection de types de