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IEC 61189-3-302-ed.1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

NORMA vydána dne 22.10.2025

Anglicky -
Elektronické PDF (3595.70 CZK)
Anglicky -
Tištěné (3595.70 CZK)
Anglicky -
CD-ROM (3634.80 CZK)


Francouzsky -
Elektronické PDF (3595.70 CZK)
Francouzsky -
Tištěné (3595.70 CZK)
Francouzsky -
CD-ROM (3634.80 CZK)


Anglicky a francouzsky -
Elektronické PDF (3595.70 CZK)
Anglicky a francouzsky -
Tištěné (3595.70 CZK)
Anglicky a francouzsky -
CD-ROM (3634.80 CZK)

The information about the standard:

Designation standards: IEC 61189-3-302-ed.1.0
Publication date standards: 22.10.2025
The number of pages: 17
Approximate weight : 51 g (0.11 lbs)
Country: International technical standard
Kategorie: Technické normy IEC

Annotation of standard text IEC 61189-3-302-ed.1.0 :

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT). This document is applicable to non-destructive testing of metallized holes. L’IEC 61189-3-302:2025 decrit la methode de detection des defauts de metallisation des cartes de circuits imprimes nus par tomographie informatisee (TI). Le present document s’applique aux essais non destructifs des trous metallises.