IEC 61189-2-803-ed.1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

NORMA vydána dne 26.7.2023

Anglicky a francouzsky -
Elektronické PDF (626.60 CZK)

Anglicky a francouzsky -

Tištěné (626.60 CZK)

Anglicky a francouzsky -

CD-ROM (665.80 CZK)

The information about the standard:

Designation standards: IEC 61189-2-803-ed.1.0
Publication date standards: 26.7.2023
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Kategorie: Technické normy IEC

Annotation of standard text IEC 61189-2-803-ed.1.0 :

IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA). LIEC 61189-2-803:2023 definit une methode dessai pour determiner la dilatation suivant laxe Z des materiaux de base et des cartes imprimees en utilisant un analyseur thermomecanique (TMA - thermomechanical analyser).