Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

The information about the standard:

Designation standards: IEC 61189-2-501-ed.1.0
Publication date standards: 3.2.2022
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: International technical standard
Kategorie: Technické normy IEC

Annotation of standard text IEC 61189-2-501-ed.1.0 :

IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test is performed on the sample as manufactured and without conditioning. The test does not apply to the resilience force lower than 10 mN. L’IEC 61189-2-501:2022 etablit une methode mettant a l’essai la souplesse d’un stratifie flexible recouvert de cuivre (FCCL, Flexible Copper Clad Laminate) et des materiaux apparentes. Cette methode determine l’elasticite dans des conditions specifiees. L’essai est effectue sur un echantillon tel que fabrique et sans conditionnement. L’essai ne s’applique pas a une force elastique inferieure a 10 mN.