Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
NORMA vydána dne 27.8.2001
Označení normy: IEC 60191-6-5-ed.1.0
Datum vydání normy: 27.8.2001
Počet stran: 10
Přibližná hmotnost: 30 g (0.07 liber)
Země: Mezinárodní technická norma
Kategorie: Technické normy IEC
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.