IEC 60191-6-5-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

NORMA vydána dne 27.8.2001

Anglicky -
Elektronické PDF (1273.90 CZK)

Anglicky -

Tištěné (1273.90 CZK)

Anglicky -

CD-ROM (1313.70 CZK)

Španělsky -

Elektronické PDF (1273.90 CZK)

Španělsky -

Tištěné (1273.90 CZK)

Španělsky -

CD-ROM (1313.70 CZK)

The information about the standard:

Designation standards: IEC 60191-6-5-ed.1.0
Publication date standards: 27.8.2001
The number of pages: 10
Approximate weight : 30 g (0.07 lbs)
Country: International technical standard
Kategorie: Technické normy IEC

Annotation of standard text IEC 60191-6-5-ed.1.0 :

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.