IEC 60191-6-4-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

NORMA vydána dne 11.6.2003

Anglicky -
Elektronické PDF (2505.80 CZK)

Anglicky -

Tištěné (2505.80 CZK)

Anglicky -

CD-ROM (2544.90 CZK)

Anglicky a francouzsky -

Elektronické PDF (2505.80 CZK)

Anglicky a francouzsky -

Tištěné (2505.80 CZK)

Anglicky a francouzsky -

CD-ROM (2544.90 CZK)

The information about the standard:

Designation standards: IEC 60191-6-4-ed.1.0
Publication date standards: 11.6.2003
The number of pages: 32
Approximate weight : 96 g (0.21 lbs)
Country: International technical standard
Kategorie: Technické normy IEC

Annotation of standard text IEC 60191-6-4-ed.1.0 :

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions. La CEI 60191-6-4:2003 couvre les exigences relatives aux methodes de mesure des dimensions des boitiers matriciels a billes (BGA).