Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
NORMA vydána dne 31.5.2010
Designation standards: IEC 60191-6-18-ed.1.0/Cor.1
Note: Oprava
Publication date standards: 31.5.2010
Approximate weight : 300 g (0.66 lbs)
Country: International technical standard
Kategorie: Technické normy IEC